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ArtemisConference Paper

Tomography Analysis of Orion Artemis 1 Heatshield Sample

Orion20232 min read258 words
Eli R Hiss, Federico Semeraro, Sergio Fraile Izquierdo, and Collin W Foster
Ames Research Center

The Orion spacecraft, under NASA's Artemis program, is an integral step in humanity's ambitions of deep space exploration, including our return to the Moon and subsequent mission to Mars. The performance of Orion's heatshield is central to ensuring the safety and success of such missions. This presentation offers a comprehensive overview of the process used in and findings derived from tomography scans of an Artemis 1 heatshield sample executed at the Lawrence Berkeley National Laboratory's Advanced Light Source. These tomography scans captured high-resolution X-Ray images of the heatshield's microstructure, allowing advanced imaging to be employed for 3D image segmentation and visualization of the sample. The Porous Media Analysis (PuMA) software stands central to our analysis, offering robust computational algorithms and methodologies to digitally compute properties of the heatshield material.

The presentation discusses the following derived metrics:

  • Volume fractions, representing the spatial distribution and amounts of various components throughout the heatshield’s depth.
  • Porosity and crack distributions, offering insights into the void space within the material, critical for understanding the heatshield's structural integrity.
  • Fiber orientation, detailing the alignment and arrangement of fibers, significant for material orthotropy.
  • Permeability estimates, quantifying the passage of gas through the material, relevant for re-entry conditions and pyrolysis gasses.

One distinctive feature of this study is the comparative evaluation against data obtained from tomography scans of the Exploration Flight Test-1 (EFT-1) heatshield. Such a comparison offers multiple insights, including evaluation of the consistency and repeatability of manufacturing processes as well as understanding of any evolutionary changes in heatshield design or material properties.


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