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Space ShuttleTechnical Memorandum (TM)

Photoelastic tests on models of thermal protection system for space shuttle orbiter

20191 min read127 words
Prabhakaran, R. and Cooper, P. A.
Legacy CDMS

The thermal protection system (TPS) of the space shuttle orbiter vehicle, consisting of ceramic tile/adhesive/strain isolator pad/adhesive/aluminum substructure, was modeled photoelasticity. A highly sensitive photoelastic material was used in the models to show the nature of the stress-transfer between the strain isolation pad (SIP) and the ceramic tile through the RTV-adhesive layer. Isochromatic fringe patterns were obtained for models subjected to tension and combined tension and bending. Tests indicated that the load-transfer between the SIP and the photoelastic material occurred at discrete locations causing stress concentrations in the photoelastic material. Stress concentration factors of the order of 1.9 were measured, but as the observed photoelastic response was an integrated effect through the model thickness, the local stress concentration factors at the SIP/tile interface could be even higher.


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